To address the stringent requirements of electronic products regarding component mounting accuracy, circuit board defects, and functional testing, Wenzhou Yihe Intelligent Technology Co., Ltd. has launched a vision inspection system covering PCBA, semiconductor packaging, and consumer electronics assembly. Utilizing 3D AOI inspection technology, it achieves an IC chip solder joint coplanarity detection accuracy of ±5μm. Combined with a self-developed multispectral imaging algorithm, it can identify 12 types of defects, including BGA solder ball bridging and residual solder balls, with a detection speed of 120pcs/min. This has helped Huawei and OPPO reduce the motherboard defect rate of their mobile phones to below 0.05%. In the semiconductor packaging field, a laser profilometer combined with a deep learning model performs sub-micron-level analysis of pin coplanarity and chip bonding offset, meeting JEDEC packaging standards and improving the detection efficiency of companies like JCET
